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Connectivity and Technical Interoperability for the IIoT field


This logic active, of transversal application, pretends to provide to the machines/installations of Additive Manufacturing, the level of CONNECTIVITY demanded in the Industry 4.0 field, covering aspects of data transport (physical media and communication protocols), but also TECHNICAL INTEROPERABILITY – via APIs (Application Programming Interfaces), between the different functional modules (sensorization, local data processing, data ingestion, stream processing, batch processing, data storage, analytics, data presentation, …) that make up the Industry 4.0-oriented platforms.
Technical interoperability deals with purely technical aspects of interoperability such as transmission protocols and data exchange formats between the functional modules.
This active propose a Reference Architecture structured in three layers ((Machine, Edge and Cloud), specially oriented to guarantee the response time (latency) and the level of security/privacy required by the services provided in each of the above layers.
The elasticity of the architecture facilitates its application in use cases of Additive Manufacturing such as: monitoring and remote control, condition-based maintenance, automation of decision-making at operational level, quality control online, etc.
This architecture refers to: a) physical means of communication: Ethernet, xDSL, Wifi, Bluetooth/BLE, ZigBee, GPRS, 3G/4G, SIGFOX, LORA, NB-IoT, … , b) Communication Protocols: OPC-UA, Modbus, HTTPS, Web Services, REST, CoAP, MQTT, …, y c) APIs to integrate functional modules: NIFI, KURA, VAGRANT, ANSIBLE, APACHE SPARK, APACHE CASSANDRA, APACHE ZEPPELIN, ...


Cloud level connectivity +

Infrastructure aimed at providing data ingestion, data storage, data analytics and data/information presentation, with a response time of the order of the second. It can communicate directly with the lower levels (Edge and Machine) using standard IIoT protocols. This infrastructure uses virtual machines and clusters installed on distributed servers to ensure the levels of availability demanded by the services. The enormous processing capacity available at this level allows to face self-learning services oriented to the modeling of the behavior of the machine, quality control on-line, unit traceability, automatic operative decision making, man-machine agile interfaces, etc.

Edge level connectivity +

Infrastructure aimed at providing data ingestion and stream processing services, with a response time of the order of the tenth of a second. Communicates with the lower level (Machine) and above (Cloud) using standard IIoT protocols. This level implements Internet technologies in a near-machine environment, on a platform (hardware/software) dimensioned according to the privacy/security and latency requirements demanded by the node-resident services. NIFI and KURA are two of the relevant elements of the EDGE node. This node plays three basic tasks: a) Provide the degree of privacy/security and latency demanded at this level, b) implement services that require aggregated data from different machines, and c) serve as a gateway between the machine and the services available in the cloud. Services related to the dynamic reconfiguration of the production line, integration of 'plug-and-play' machines, 'quasi-real' time monitoring of the critical process variables, and intelligent maintenance based on conditions, are Just some of the typical services on this level.

Machine level connectivity +

Wired Communication (UART, GPIO, SPI, I2C, CAN, USB,...) and wireless (IR, Bluetooth, Wifi, Zigbee, LPWAN,...) with industrial devices (CNCs, PLCs, transducers). Real-time local data processing capability. It can communicate directly with the upper levels (Edge and Cloud) using standard protocols in the IIoT field. Configuration, calibration, filtering/data adequacy and security-related decision-making services are typical at this level.


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Education, training, experimentation

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IIoT Technical Interoperability

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Techinal connectivity

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Technical Interoperability and Connectivity demonstrators




Contact person:

Lorenzo Manero Peláez


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