DualBeam QUANTA3DFEG equipment from FEI. It has a high-resolution scanning electron microscope (~1nm) and a Gallium ion cannon that allows the deposition and ablation of material. In addition, there has been developed an image analysis software that allows to solve the residual stresses from the images obtained from FEGSEM before and after FIB milling in a range of scales from 1 um to 800 um and 0.5 - 50 um depth.
MOST OUTSTANDING EQUIPMENT AND COMPONENTS
Digital Image Correlation software developed by CEIT-IK4 in MATLAB
SERVICES OFFERED BY THE ASSET
Measurement of residual stress profiled across welding and HAZ
Distribution of residual stresses across a welded surface with micrometric resolution. Study of the profile of residual stresses across the Heat Affected Zone (HAZ).
Measurement of stress profiles in depth of machined surfaces
Measurement of the evolution of the residual stress tensor with depth in the range of 0.5-50 micron. More sensitive within this range that conventional hole drilling techniques
Measurement of the distribution of residual stresses along a machined surface
Distribution of residual stresses along a machined surface with micrometric resolution. No alternative method is currently available with this spatial resolution.